Along with the rapid development of microelectronics technology, printed circuit board (PCB) manufacture developed quickly to multi-layer, laminating, functionalization and integration. The printed circuit design uses a lot of tiny holes, narrow pitch, fine wires to make PCB manufacturing technology more difficult. The conventional vertical plating process can not meet the technical requirement of high-quality&high-reliability interconnected pores, thus produced horizontal plating technology. At first, the anode of horizontal plating copper wire followed the copper ball of vertical plating wires, but to reduce in mass production to disassemble frequently, repeatedly supply copper balls, then switched to the insoluble titanium mesh anode. But insoluble titanium mesh anodes in plating has a conductive function, no longer appears the main reaction of solution copper. This feature, insoluble anode of horizontal plating copper process of PCB determined that need require to replenish intermittently  copper ions in the production process to maintain the concentration of copper ion in the bath. The supplement of copper ions in acid copper plating system mainly relied on copper oxide to complete for the moment of PCB industry standards. The era, of which copper oxide applied to level plating copper of circuit board is coming soon.

Preparation method of existing active copper oxide divides into dry and wet process, and in the majority of wet process, but particles of active copper oxide products are fine, which produced by wet method, resulting in impurities in the product are not easy to wash away, thus affecting the purity of the products; In order to completely remove impurities to get high purity of active copper oxide, it requires a large amount of washing water to wash repeatedly. Then it will not only increase costs but also seriously affect producing efficiency. And most wet process uses ammonia or ammonium salts, but complete recovery of ammonia in the waste water is very difficult, it will inevitably lead to ammonia nitrogen pollution.

To solve the shortage of the existing technology, the object of the present invention is  to provide a industrial method, which make directly active copper oxide from electronic waste water, so that the resulting copper oxide not only has high activity, also enables particles to have good dispersion, and simplify the process and improve production efficiency, thereby reducing the production cost of active copper oxide; Meanwhile, solve the pollution problems of ammonia nitrogen in producing active copper oxide by the conventional method. Using this technology, the direct preparation active copper oxide from acidic copper chloride effluent, the impurities in the effluent is mainly sodium chloride with no pollution to the environment.

Superfine active electroplating copper oxide prepared by this technique, with low investment, high yield (more than 99%), high purity (more than 99%) and fast dissolution (dissolution time about 20 seconds, far lower than similar standard of 30 seconds).

We have applied for patent protection for the technology, patent application number: 201210123571.5